Electroplate bond blade with hub can be mainly used to groove, cut and disc silicon, glass, ceramic, quartz and compound semiconductor material wafer in integrated chips and discrete devices production.
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2、Cutting wheel without steel core
Cutting wheels without steel plate are manufactured with identical material. Thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and slight cutting depth. There are two kinds of bond: Metal bond (M) and Resin bond (B).
Metal Bond cutting wheel (without steel core)
Future: The grits are strongly held on;
The wheels have Good wear resistance, long life span and good shape maintenance.
Resin Bond cutting wheel (without steel core)
Future: The resin bond cutting wheels can self-sharpen and cut sharply. The quality of surface can be improved due to the elastic resin bond.
Shape: 1A8/1 type without water slot and1A8/2 type with water slot.
3、cutting wheel with steel core
This kind of cutting wheel is compound of steel plate and work layer. The steel plate has high strength and high rigidity. They are generally used for deep cutting and grooving.
There are two kinds of bond: Metal bond (M) and Resin bond (B).
Metal Bond cutting wheel (with steel core)
Future: The grits are strongly held on;
Good wear resistance, long life span and good shape maintenance.
Resin Bond cutting wheel (with steel core)Feature: These wheels can self-sharpen and cut sharply. The work quality can be improved due to the elastic resin bond.
Shape: 1A1/3、1A1R/4 type without water slot and1A1/5、 1A1R/6 type with water slot.
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| Super-thin cutting wheels |
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| Super-thin cutting wheels |
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| Super-thin cutting wheels |
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