Grinding wheel-Metal Bond Diamond Micron

Metal Bond Diamond Micron

Metal bond diamond Micron can provide good surface finishing on the workpieces. Suitable for resin、 vitrified、metal and electroplated bond tools requiring finnier finishes. .

Hi-Tech Product Types:
DML-I series

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Characters: 
Economical Diamond
Angle and irregular shape, Friable,
low toughness, Good Grinding efficiency.
Application: Lapping, grinding or polishing on: PCD, ceramics, stone and other workpieces.

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DMM series

Characters: 
Semi-blocky shape, medium-high toughness, uniform Particle Size   Distribution
Good Grinding efficiency.
Application: Cutting, lapping, grinding and polishing on: silicon glass, optical glass, ceramic, and etc.

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DMH series

Characters:  
Blocky shape, high toughness, uniform Particle Size Distribution,
Application: Grinding and polishing optical glass, fine ceramics, gem stone, semi-conductor and etc.

Size Availability :

Grit Size	D50（μm）
0-0.2	0.080~0.110
0-0.25	0.111~0.249
0-0.5	0.250~0.449
0-1	0.450~0.580
0-2	0.872~0.985
1-3	1.488~1.712
2-4	2.303~2.754
3-6	3.313~3.898
4-8	4.677~5.400
5-10	6.063~6.700
6-12	7.674~8.549
8-16	9.484~10.78
10-20	12.57~14.18
12-22	14.19~16.05
15-25	17.66~19.55
20-30	19.56~22.50
22-36	22.51~26.12
20-40	26.13~30.10
30-40	30.11~34.58
36-54	39.00~43.21
40-60	43.21~47.50
Other Grit sizes are also available by customer requirement.